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MCP6004T-E/ST

Microchip Technology

Quad Op Amp - Low Power - 1MHz GBP - 1.8 to 6.0 VDC - Rail to Rail I/O - 14-lead TSSOP - -40°C to +125°C

FICHA TÉCNICA

Cumple con RoHS

REEL embalaje

DESCRIPCIÓN

The MCP6004T-E/ST is a low power quad operational amplifier, designed for general-purpose applications. Extended temp. range -40°C-125°C. Package type is a Plastic TSSOP, (4.4 mm body), 14-lead.

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Palabras clave de búsqueda: MCP6004TEST

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EN STOCK: 5.000

Puede enviar inmediatamente

Cantidad BONDED: 0

Stock del fabricante: 12 puede enviar 5/18/26

Stock lot only:

Cantidad mínima de pedido: 500

MOQ para cantidad agotada:

Múltiple: 1

Plazo de entrega de fábrica 4 Semanas puede enviar 6/1/26

Este producto ya no se fabrica, pero puede haber alternativas. Te podemos ayudar, Contacta con nosotras.

Qty

Precio por unidad

500

$0.4378

1.000

$0.4099

2.500

$0.4059

5.000

$0.4039

7.500

$0.4019

10.000

$0.3998

15.000

$0.3978

25.000 +

$0.3959

Reel Package

Tools/3D Models

Guías de productos

FICHA TÉCNICA

Product Changes

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 19-Nov-2009 - Microchip has released a new DeviceDoc for the MCP6001/R/U/2/4, 1 MHz, Low-Power Op Amp of devices.

PCN - 13-Jul-2006 - Product Change Notice

PCN - 06-Sep-2012 - Microchip Is Announcing The Qualification Of Mmt (Alph) Assembly Site For The Listed 14L Tssop Packa

PCN - 12-Apr-2012 - Microchip Is Announcing The Qualification Of Mmt (Alph) Assembly Site For The Listed 14L Tssop Packa

PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic

PCN - 22-Jan-2004 - Qualify Unisem For Assembly Of 14L Tssop Package

PCN - 31-Jul-2007 - Qualification Of 14L Tssop Package Assembly At Vgt (Vigilant, Thailand)

PCN - 31-May-2007 - Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 30-Apr-2007 - Qualification Of 14L Pdip With Ge-800 ''Green'' Mold Compound At Vgt Assembly

PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

PCN - 25-Oct-2004 - Change From Snpb Plating To Matte Tin Plating (Industry-Standard Pure Sn) Of The Device Leads

PCN - 31-Mar-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 20-Feb-2007 - Product Change Notice

PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.

PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP

PCN - 11-Nov-2004 - Product Change Notice

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 18-Aug-2012 - Qualification Of 14L Tssop Package At Mmt (Alph) Assembly Site

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 30-Apr-2007 - Product Change Notice

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 19-Mar-2007 - Product Change Notice

PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

Product Change Notification

Master Electronics - Distribuidor Autorizado de Componentes Electrónicos

Master Electronics - Distribuidor Autorizado de Componentes Electrónicos

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MCP6004T-E/ST

DESCRIPCIÓN

ESPECIFICACIÓN

Standard Packaging

Reel Packaging

Tools/3D Models

Guías de productos

Product Changes