描述

The 536501-3 is a Z-PACK 2mm Futurebus+ connector featuring a 4-row signal module vertical pin assembly with 16mm wide body design. The housing is constructed from liquid crystal polymer with phosphor bronze pin contacts plated with nickel underplate (0.00127 mm minimum) and mating surface plating conforming to Telcordia specifications for uncontrolled environments. The assembly offers both solder leads (4.25 mm lead length) and compliant press-fit lead options, with a mating post length of 13.60 mm and 3 spaces at 2.00 mm pitch. This connector is designed for high-density signal interconnection in Futurebus+ systems, providing reliable electrical and mechanical performance in demanding industrial and telecommunications applications.