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583859-5 by te connectivity / amp brand
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583859-5

TW-LF CRP HSG 18 POS ...

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符合 RoHS
BAG 包装
附件
请求编程报价
合规证书

描述

583859-5 is a crimp snap twin leaf connector housing designed for high-density wire-to-board applications. This connector features 18 dual positions with a 0.156 inch (3.96 mm) centerline spacing and includes mounting ears for secure PCB attachment. Key dimensions include A: 2.972 inches (75.49 mm), B: 3.136 inches (79.55 mm), C: 2.848 inches (72.34 mm), D: 3.407 inches (86.54 mm), and E: 3.657 inches (92.89 mm). The housing is designed to accommodate PC boards with thickness of 0.055-0.070 inches (1.40-1.78 mm) and accepts snap-in contacts in various configurations including crimp, post, eyelet, and solder types. This versatile connector is suitable for wire-to-board and board-to-board interconnect applications requiring reliable, high-density connections.

产品亮点:

  • Housing
  • 18 Dual Positions
  • 3.96 mm Centerline
  • With Mounting Ears

搜索关键词: 5838595

规格

产品属性
属性值
选择属性
找到的产品: 0
供应商:
TE Connectivity / AMP Brand
部件编号:
583859-5
计量单位:
每 Each
RoHS:
Yes
HTS:
8538906000
COO:
US
ECCN:
EAR99
供应商标准包装: 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
1
封装类型:
BAG
安装方式:
Cable Mount
本体方向:
Straight
公母类型:
RCP
触点数量:
36
最大电压额定值:
N/A
最大电流额定值:
N/A
工作温度:
-55 to 105 °C

FREQUENTLY ASKED QUESTIONS

Is 583859-5 RoHS compliant?

Yes, 583859-5 is RoHS compliant.

What is the lead time for 583859-5?

The standard lead time for 583859-5 is approximately 9 days. In-stock quantities ship from Master Electronics.

有存货: 1,825

可立即发货

库存数量的起订量: 7

缺货数量的起订量: 7

工厂交货期 9 周

价格 (USD)

数量
单价
7
$81.19
25
$80.99
50
$80.78
100
$80.59
200
$42.53
300
$29.25
400 +
$28.66