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描述
583859-5 is a crimp snap twin leaf connector housing designed for high-density wire-to-board applications. This connector features 18 dual positions with a 0.156 inch (3.96 mm) centerline spacing and includes mounting ears for secure PCB attachment. Key dimensions include A: 2.972 inches (75.49 mm), B: 3.136 inches (79.55 mm), C: 2.848 inches (72.34 mm), D: 3.407 inches (86.54 mm), and E: 3.657 inches (92.89 mm). The housing is designed to accommodate PC boards with thickness of 0.055-0.070 inches (1.40-1.78 mm) and accepts snap-in contacts in various configurations including crimp, post, eyelet, and solder types. This versatile connector is suitable for wire-to-board and board-to-board interconnect applications requiring reliable, high-density connections.
产品亮点:
- Housing
- 18 Dual Positions
- 3.96 mm Centerline
- With Mounting Ears
搜索关键词: 5838595
规格
常见问题
583859-5 是否符合 RoHS 标准？
是的，583859-5 符合 RoHS 标准。
583859-5 的交货期是多少？
583859-5 的标准交货期约为 9 周。有库存的数量由 Master Electronics 发货。
有存货: 1,825
可立即发货
库存数量的起订量: 4
缺货数量的起订量: 4
工厂交货期 9 周
Product Drawing - HOUSING, CRIMP SNAP TWIN LEAF, .156
数据表
Product Specification - Twin Leaf Crimp Snap Connector
Instruction Sheet - Twin Leaf Printed Circuit (PC) Board Edge Connectors
