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7173DG by boyd laconia llc
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7173DG

Boyd Laconia LLC

Heat Sink Passive TO-220 Thru-Hole Copper 25.8°C/W Tin ...

产品说明书
符合 RoHS 规定
Bulk 包装
附件
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描述

7173DG is a channel board level heat sink designed to cool TO-220 and TO-220-single gauge devices. Constructed from copper with a tin-plated finish, this heat sink features dimensions of 19.05 mm width, 9.52 mm length, and 19.05 mm height with vertical mounting orientation. The design includes a 3.81 mm through-hole and specific mounting dimensions with X dimension of 9.22 mm, Y dimension of 4.11 mm, and Z dimension of 2.54 mm. This RoHS compliant heat sink requires a mounting kit for device attachment and is ideal for board level thermal management applications where efficient heat dissipation from power semiconductors is required.

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规格

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供应商:
Boyd Laconia LLC
部件编号:
7173DG
Alias/AKA:
043243
计量单位:
Per Each
RoHS:
Yes
HTS:
8536694040
COO:
CN
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3000
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
19.05 x 9.52 x 19.05 mm
Thermal Resistance:
25.8 °C/W
Finish:
Tin

有存货: 12,172

可立即发货

Minimum Order Quantity: 10

工厂交货期 6 周

PRICE (USD)

数量
Unit Price
10
$2.392
50
$2.386
250
$0.627
500
$0.603
1,000
$0.585
3,000
$0.584
6,000
$0.582
9,000 +
$0.581
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