Iniciar sesión
ES
English
中文 / 汉语
Deutsch
Español
Nederlands
2-87456-5
30 MODIV HSG COMP DR .100CL ...
DESCRIPCIÓN
The 2-87456-5 is a double-row receptacle housing assembly part of the AMPMODU Mod IV Interconnection System, designed for wire-to-board applications with a plain housing configuration. It features a low-profile, end-stackable design with .100 x .100 inch [2.54 x 2.54 mm] centerline spacing and dual entry capability, accommodating .200 inch [5.08 mm] tine spacing. The housing is constructed from glass-filled thermoplastic material rated 94V-0 and is available in multiple position configurations ranging from 2 to 72 positions. The assembly accepts standard pressure contacts (part 6-87756-6) and supports wire termination for 32-20 AWG [0.03-0.6 mm²] discrete wire with a contact current rating of 3 amperes and maximum termination resistance of 12-20 milliohms depending on contact material. This receptacle assembly is commonly used in industrial control systems, telecommunications equipment, and consumer electronics where reliable, stackable interconnections are required.
Características destacadas:
- Receptacle Housing
- Wire Termination Type = Crimp
- Number of Positions = 30
- Housing Type = Receptacle
- Number of Rows = Dual
Palabras clave de búsqueda: 2874565
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 2-87456-5 con la normativa RoHS?
Sí, 2-87456-5 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 2-87456-5?
El plazo de entrega estándar de 2-87456-5 es de aproximadamente 49 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 85
Puede enviar inmediatamente
Compre todos los 85 en stock o la cantidad mínima regular de pedido de 250
Solo lote de stock: 85
MOQ para Cantidad en Stock: 250
MOQ para cantidad agotada: 250
Plazo de entrega de fábrica 49 Semanas
Precio (USD)
3D PDF
Hoja de datos
Product Specification - AMPMODU Mod 1/2 Wire to Board Standard Pressure Contact Interconnection System
