532702B02500G
The 532702B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 and TO-220-single gauge devices. ...
DESCRIPCIÓN
The 532702B02500G is a dual radial, board-level heat sink from the High Power Extruded 5320 series, intended for thermal management of electronic components. It is specifically designed to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 41.91 mm in width, 25.40 mm in length, and has a height of 50.80 mm. Designed for vertical mounting on a printed circuit board, it is ideal for high-power applications where efficient heat dissipation from power transistors or regulators is critical to ensure system reliability.
Palabras clave de búsqueda: 532702B02500G
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 532702B02500G con la normativa RoHS?
Sí, 532702B02500G cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 532702B02500G?
El plazo de entrega estándar de 532702B02500G es de aproximadamente 9 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 2.920
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido: 5
Plazo de entrega de fábrica 9 Semanas
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