1-87499-2
06 MODIV HSG COMP SR .100CL ...
DESCRIPCIÓN
The 1-87499-2 is a single-row receptacle housing assembly part of the AMPMODU Mod IV Interconnection System, designed for wire-to-board connections with dual entry and end-stackable configuration. The housing features a 0.100 inch by 0.100 inch [2.54 x 2.54 mm] centerline spacing with low-profile design and 0.200 inch [5.08 mm] tine spacing, constructed from glass-filled thermoplastic material rated 94V-0. The contact area includes localized gold plating with duplex plating options (Plating A, B, or C) on matte tin solder areas, all over 0.00127 inch [0.00127 mm] nickel, and the assembly is RoHS compliant. This receptacle housing is suitable for applications requiring reliable multi-position interconnections in compact, stackable configurations, with contact current ratings of 3 amperes and termination resistance of 12 milliohms maximum for beryllium copper contacts.
Características destacadas:
- Connector
- Without Contacts
- Housing Gender = Connector - Receptacle
- Housing Accepts Contact Type = Receptacle
- 2.54 mm Centerline
Palabras clave de búsqueda: 1874992
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 1-87499-2 con la normativa RoHS?
Sí, 1-87499-2 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 1-87499-2?
El plazo de entrega estándar de 1-87499-2 es de aproximadamente 49 días. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 5.851
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Cantidad mínima de pedido: 50
Plazo de entrega de fábrica 49 Semanas
Precio (USD)
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