描述
The 103908-3 is a swaged tall vertical through-hole header designed for the AMPMODU MTE interconnect system, featuring 30 µ" gold plating for enhanced corrosion resistance and reliability. This header is engineered to provide retention in PC board applications through its swage option on posts, ensuring secure mechanical and electrical connections. It supports wire-to-board configurations with latching and polarization capabilities, accommodating 2-25 positions per row with a 100 mil centerline spacing. The product operates reliably across a wide temperature range of -65°C to +105°C and handles a maximum current of 3 amps per single contact in free air at 267 V operating voltage. This header is commonly used in medical instruments, automotive controls, computers, commercial printers, appliances, and telecommunications equipment where robust interconnection and high reliability are essential.
产品亮点:
- Header
- Number of Positions = 4
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
搜索关键词: 1039083
规格
常见问题
103908-3 是否符合 RoHS 标准?
不,103908-3 不符合 RoHS 标准。
103908-3 的交货期是多少?
103908-3 的标准交货期约为 17 周。有库存的数量由 Master Electronics 发货。
有存货: 5,423
可立即发货
最小订购数量: 42
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 42
工厂交货期 17 周
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