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ATS-60001-C1-R0
37.6 x 37.6 x 4.0 mm BGA Heat Sink - High Performance Ultra Low Profile 4.0 mm high adhesive thermal tape blue anodized aluminum ...
描述
The ATS-60001-C1-R0 is a high-performance, ultra-low profile BGA heat sink designed by Advanced Thermal Solutions, Inc. It has a compact size of 37.6 x 37.6 x 4.0 mm, making it ideal for space-constrained applications. Constructed from blue anodized aluminum, this heat sink offers excellent heat dissipation and enhanced durability. It features a 4.0 mm height to efficiently cool high-power BGA devices. Equipped with a high-quality adhesive thermal tape, the ATS-60001-C1-R0 can be easily mounted onto your BGA components, providing an efficient thermal connection for optimal heat transfer. Whether used in consumer electronics, telecommunications, or industrial applications, this BGA heat sink can effectively keep your components cool and ensure their reliable operation.
搜索关键词: ATS60001C1R0
规格
常见问题
ATS-60001-C1-R0 是否符合 RoHS 标准？
是的，ATS-60001-C1-R0 符合 RoHS 标准。
ATS-60001-C1-R0 的交货期是多少？
ATS-60001-C1-R0 的标准交货期约为 8 周。有库存的数量由 Master Electronics 发货。
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