624-25ABT3
The 624-25ABT3 is an omnidirectional aluminum pin fin heat sink with a pre-applied thermal adhesive, designed for cooling 21mm BGA packages. ...
BESCHRIJVING
The 624-25ABT3 is an omnidirectional pin fin heat sink designed for thermal management of 21mm BGA packages in both natural and forced-convection environments. It is constructed from black anodized aluminum with base dimensions of 0.827 inches square and a fin height of 0.250 inches. This part includes a pre-applied Chomerics T412 (-T3) pressure-sensitive adhesive, which provides a thermal impedance of 0.25 C-in^2/W and is ideal for metal or ceramic surfaces. The integrated adhesive allows for quick and easy mounting, providing a reliable thermal link to the electronic package.
Zoekwoorden: 62425ABT3
SPECIFICATIES
VEELGESTELDE VRAGEN
Is 624-25ABT3 RoHS-conform?
Ja, 624-25ABT3 is RoHS-conform.
Wat is de levertijd voor 624-25ABT3?
De standaard levertijd voor 624-25ABT3 is ongeveer 16 weken. Voorraadhoeveelheden worden verzonden vanuit Master Electronics.
OP VOORRAAD: 1.705
Kan direct verzenden
Minimale bestelhoeveelheid: 25
Fabriekslevertijd 16 Weken
English
中文 / 汉语
Deutsch
Español
Nederlands
