BESCHRIJVING
The 2338495-3 is a 1x4 OSFP cage assembly with open back configuration designed to support next-generation data center connectivity. It features an 8-lane high-density connector with 0.6 mm pitch and 60 contacts total, following the OSFP MSA specification, with a simple low-cost wafer design utilizing 2 rows of contacts. The open back design allows airflow through the module shell to cool downstream electronics in front-to-back airflow systems or exhaust for back-to-front airflow, while the belly-to-belly capable design via in-ground alignment reduces PCB cost and noise. Proven to support 56G PAM-4 protocols with a roadmap to 112G PAM-4, this cage assembly supports aggregate data rates up to 800 Gbps and thermal loads up to 15W with low airflow, making it ideal for high-port-density switch form factors that can accommodate up to 32 ports in a 1RU configuration.
Zoekwoorden: 23384953
SPECIFICATIES
VEELGESTELDE VRAGEN
Is 2338495-3 RoHS-conform?
Ja, 2338495-3 is RoHS-conform.
Wat is de levertijd voor 2338495-3?
De standaard levertijd voor 2338495-3 is ongeveer 9 weken. Voorraadhoeveelheden worden verzonden vanuit Master Electronics.
OP VOORRAAD: 36
Kan direct verzenden
MOQ voor voorraadhoeveelheid: 3
MOQ voor niet-voorraadhoeveelheid: 3
Fabriekslevertijd 9 Weken
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