BESCHRIJVING
583859-5 is a crimp snap twin leaf connector housing designed for high-density wire-to-board applications. This connector features 18 dual positions with a 0.156 inch (3.96 mm) centerline spacing and includes mounting ears for secure PCB attachment. Key dimensions include A: 2.972 inches (75.49 mm), B: 3.136 inches (79.55 mm), C: 2.848 inches (72.34 mm), D: 3.407 inches (86.54 mm), and E: 3.657 inches (92.89 mm). The housing is designed to accommodate PC boards with thickness of 0.055-0.070 inches (1.40-1.78 mm) and accepts snap-in contacts in various configurations including crimp, post, eyelet, and solder types. This versatile connector is suitable for wire-to-board and board-to-board interconnect applications requiring reliable, high-density connections.
Productkenmerken:
- Housing
- 18 Dual Positions
- 3.96 mm Centerline
- With Mounting Ears
Zoekwoorden: 5838595
SPECIFICATIES
VEELGESTELDE VRAGEN
Is 583859-5 RoHS-conform?
Ja, 583859-5 is RoHS-conform.
Wat is de levertijd voor 583859-5?
De standaard levertijd voor 583859-5 is ongeveer 9 dagen. Voorraadhoeveelheden worden verzonden vanuit Master Electronics.
OP VOORRAAD: 1.825
Verzending today, als u bestelt in
MOQ voor voorraadhoeveelheid: 7
MOQ voor niet-voorraadhoeveelheid: 7
Fabriekslevertijd 9 Weken
English
中文 / 汉语
Deutsch
Español
Nederlands
