ALTERNATIEVE PRODUCTEN

Alternatieve verpakking

93LC66AT-I/SN

Op voorraad: 5.600
Minimumbestelling: 1.000

PRODUCT BEKIJKEN

93LC66A-I/SN by microchip technology

Afbeelding is ter illustratie - zie fabrikantspecificaties

Microchip Technology Geautoriseerde distributeur

93LC66A-I/SN

EEPROM - Serial-Microwire - 4Kbit (512 x 8) - 3.3V/5V - 8-Pin SOIC N - Tube

Bekijk gegevensblad

RoHS-conform

TUBE Verpakking

BESCHRIJVING

EEPROM - Serial-Microwire - 4Kbit (512 x 8) - 3.3V/5V - 8-Pin SOIC N - Tube

Productkenmerken:

Mogelijke toepassingen:

Zoekwoorden: 93LC66AISN

SPECIFICATIES

Productkenmerk

Attribuutwaarde

Selecteer kenmerk

Producten gevonden: 0

Leverancier:

Microchip Technology

Onderdeelnr.:

93LC66A-I/SN

Meeteenheid:

Per Each

RoHS:

Yes

HTS:

8542320051

COO:

TH

ECCN:

EAR99

Standaardverpakking leverancier: Deze informatie wordt verstrekt voor klanten die de voorkeur geven aan het kopen in veelvouden van de standaardverpakkingshoeveelheid van de fabrikant. Minimale bestelhoeveelheden en vereiste bestelveelvouden worden weergegeven bij onze prijs- en beschikbaarheidsinformatie.

Deze informatie wordt verstrekt voor klanten die de voorkeur geven aan het kopen in veelvouden van de standaardverpakkingshoeveelheid van de fabrikant. Minimale bestelhoeveelheden en vereiste bestelveelvouden worden weergegeven bij onze prijs- en beschikbaarheidsinformatie.

100

Verpakkingstype:

TUBE

Data Retention:

200(Min) Year

VEELGESTELDE VRAGEN

Is 93LC66A-I/SN RoHS-conform?

Ja, 93LC66A-I/SN is RoHS-conform.

Wat is de levertijd voor 93LC66A-I/SN?

De standaard levertijd voor 93LC66A-I/SN is ongeveer 6 dagen. Voorraadhoeveelheden worden verzonden vanuit Master Electronics.

Verschillende verpakkingsopties beschikbaar. Bekijk alternatieven

OP VOORRAAD: 2.202

Verzending today, als u bestelt in

BONDED-hoeveelheid: 0

Fabrieksvoorraad: 11.280 kan verzenden 9-7-26

Alleen voorraadpartij: 2

Minimale bestelhoeveelheid: 100

MOQ voor niet-voorraadhoeveelheid:

Meerdere: 100

Fabriekslevertijd 6 Weken kan verzenden 10-7-26

Dit product wordt niet langer geproduceerd, maar er zijn mogelijk alternatieven. Wij kunnen u helpen, Neem contact op.

Prijs (USD)

Aantal

Prijs per eenheid

100

$0.3464

500

$0.3349

1.000

$0.3319

2.500

$0.3294

5.000

$0.3278

7.500

$0.3270

10.000

$0.3262

15.000 +

$0.3253

Standaardverpakking van leverancier

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PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

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PCN - 07-Apr-2022 - MANUFACTURING CHANGE

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON

PCN - 18-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

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PCN - 01-Feb-2022 - CANCEL QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

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PCN - 09-May-2005 - QUALIFICATION OF 6L SOT-23 PACKAGE AT HANA

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS

PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

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PCN - 28-Jun-2005 -

PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 08-Nov-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 09-May-2003 -

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

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PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 22-Sep-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 09-May-2003 -

PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB

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PCN - 23-Sep-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 15-Dec-2011 - MICROWIRE COMPATIBLE SERIAL EEPROM DATA SHEET DOCUMENT REVISION

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PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 26-May-2005 - QUALIFICATION OF 8L DFN PACKAGE AT NSEB

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

PCN - 20-Mar-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 30-Jan-2006 -

PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

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PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

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PCN - 16-Feb-2022 - MANUFACTURING CHANGE

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PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

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PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

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PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

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PCN - 11-Nov-2004 -

PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 22-Jan-2004 -

PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

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PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

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