513202B02500G
The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices. ...
BESCHRIJVING
The 513202B02500G is a dual radial, board-level heat sink from the Extruded 5000 series, specifically designed for the thermal management of TO-220 packaged devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 50.80 mm in height and 34.92 mm in width. It features solderable pins for secure board attachment and can be mounted in either a horizontal or vertical orientation. This component is ideal for applications requiring efficient heat dissipation from power components on a printed circuit board, ensuring device reliability and performance.
Zoekwoorden: 513202B02500G
SPECIFICATIES
VEELGESTELDE VRAGEN
Is 513202B02500G RoHS-conform?
Ja, 513202B02500G is RoHS-conform.
Wat is de levertijd voor 513202B02500G?
De standaard levertijd voor 513202B02500G is ongeveer 8 weken. Voorraadhoeveelheden worden verzonden vanuit Master Electronics.
OP VOORRAAD: 0
Minimale bestelhoeveelheid: 5
Fabriekslevertijd 8 Weken
English
中文 / 汉语
Deutsch
Español
Nederlands
