ATS-60001-C1-R0
37.6 x 37.6 x 4.0 mm BGA Heat Sink - High Performance Ultra Low Profile 4.0 mm high adhesive thermal tape blue anodized aluminum ...
BESCHRIJVING
The ATS-60001-C1-R0 is a high-performance, ultra-low profile BGA heat sink designed by Advanced Thermal Solutions, Inc. It has a compact size of 37.6 x 37.6 x 4.0 mm, making it ideal for space-constrained applications. Constructed from blue anodized aluminum, this heat sink offers excellent heat dissipation and enhanced durability. It features a 4.0 mm height to efficiently cool high-power BGA devices. Equipped with a high-quality adhesive thermal tape, the ATS-60001-C1-R0 can be easily mounted onto your BGA components, providing an efficient thermal connection for optimal heat transfer. Whether used in consumer electronics, telecommunications, or industrial applications, this BGA heat sink can effectively keep your components cool and ensure their reliable operation.
Zoekwoorden: ATS60001C1R0
SPECIFICATIES
VEELGESTELDE VRAGEN
Is ATS-60001-C1-R0 RoHS-conform?
Ja, ATS-60001-C1-R0 is RoHS-conform.
Wat is de levertijd voor ATS-60001-C1-R0?
De standaard levertijd voor ATS-60001-C1-R0 is ongeveer 8 weken. Voorraadhoeveelheden worden verzonden vanuit Master Electronics.
OP VOORRAAD: 0
Fabrieksvoorraad: 122 kan verzenden 10-19-26
MOQ voor niet-voorraadhoeveelheid: 25
Fabriekslevertijd 8 Weken kan verzenden 11-30-26
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