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EXP-355
Solderless Breadboard, 588 Tie-points | Global Specialties EXP-355 ...
BESCHRIJVING
The EXP-355 is a solderless breadboard featuring 470 tie-points and 94 terminal clips designed for rapid circuit prototyping and design expansion. It incorporates molded-in interlocking edge rails on all four sides that permit parallel or perpendicular socket arrays, allowing multiple boards to be connected for maximum circuit design flexibility. The breadboard is constructed from high-impact ABS plastic with nickel-plated phosphor bronze spring clips and includes a heavy-duty Mylar backing to prevent short circuits. With 0.3" DIP spacing, integrated bus strips for power and signal connections, and the ability to accommodate up to 5 16-pin ICs, the EXP-355 supports a current capacity of 1.5 A at 36 V. Its molded-in mounting holes enable both front and rear mounting configurations, making it ideal for educational, hobbyist, and professional prototyping applications where circuit flexibility and reliability are essential.
Zoekwoorden: EXP355
SPECIFICATIES
VEELGESTELDE VRAGEN
Is EXP-355 RoHS-conform?
Ja, EXP-355 is RoHS-conform.
Wat is de levertijd voor EXP-355?
De standaard levertijd voor EXP-355 is ongeveer 14 weken. Voorraadhoeveelheden worden verzonden vanuit Master Electronics.
OP VOORRAAD: 0
Fabriekslevertijd 14 Weken
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