573300D00010G

Name: 573300D00010G Boyd Laconia Llc Heat Sinks
Brand: Boyd Laconia Llc
SKU: 44922659
Availability: InStock

Heat Sink Passive D2 PAK/TO-263 SMD Aluminum Black Anodized ...

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RoHS-conform

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Conformiteitscertificaat

BESCHRIJVING

The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.

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Zoekwoorden: 573300D00010G

SPECIFICATIES

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Leverancier:

Boyd Laconia LLC

Onderdeelnr.:

573300D00010G

Alias/ook bekend als:

041644

Meeteenheid:

Per Each

RoHS:

Yes

HTS:

8473309000

COO:

ECCN:

EAR99

Rolverpakking: Deze informatie wordt verstrekt voor klanten die de voorkeur geven aan het kopen in veelvouden van de standaardverpakkingshoeveelheid van de fabrikant. Minimale bestelhoeveelheden en vereiste bestelveelvouden worden weergegeven bij onze prijs- en beschikbaarheidsinformatie.