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描述
The 540-AG11D is a 40-position DIP socket designed for vertical thru-hole mounting on printed circuit boards. It features beryllium copper screw machine contacts with gold plating (25 µin) on the mating area, providing reliable electrical connections and corrosion resistance. The socket has a row-to-row spacing of 15.24 mm (0.600 in), a centerline of 2.54 mm (0.100 in), and a height above the PCB of 4.57 mm (0.180 in), with four-fingered mating contact design for secure component retention. It is wave solder capable up to 265°C and operates reliably at temperatures up to 125°C, making it suitable for industrial and commercial applications requiring robust IC socket solutions.
产品亮点:
- DIP Socket
- Number of Positions = 40
- Row-to-Row Spacing = 15.24 mm
- Thru Hole
- Mount Style = Vertical
搜索关键词: 714375364
规格
常见问题
7-1437536-4 是否已停产？
是的，Te Connectivity / Amp Brand 的 7-1437536-4 已停产（生命周期结束时间：九月 2021）。Master Electronics 是授权分销商，可能仍有剩余库存或可提供推荐的替代产品。
什么产品可以替代 7-1437536-4？
7-1437536-4 的推荐替代产品是 TE Connectivity / Buchanan Brand 的 540-AG11D，可从 Master Electronics 购买。
7-1437536-4 是否符合 RoHS 标准？
不，7-1437536-4 不符合 RoHS 标准。
7-1437536-4 的交货期是多少？
7-1437536-4 的标准交货期约为 6 周。有库存的数量由 Master Electronics 发货。
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