描述
The 1-103735-1 is a vertical through-hole (THT) header connector for the TE Connectivity AMPMODU MTE interconnect system, featuring 30 µ" gold plating for enhanced durability and reliability. This connector supports 2–25 positions per row in single-row configurations and accommodates wire gauges from #22–#30 AWG for IDC (Insulation Displacement Contact) configurations. The connector operates at a maximum current rating of 3 amps per single contact in free air and maintains performance across an operating temperature range of -65°C to +105°C. It features latching and polarization capabilities with a 100 mil centerline pitch, making it suitable for wire-to-board applications in computers, medical equipment, automotive controls, appliances, and industrial instrumentation. The swage option on posts provides secure retention in printed circuit boards, and the design supports both manual and automated assembly processes.
产品亮点:
- Header
- Number of Positions = 12
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
搜索关键词: 11037351
规格
常见问题
1-103735-1 是否符合 RoHS 标准?
不,1-103735-1 不符合 RoHS 标准。
1-103735-1 的交货期是多少?
1-103735-1 的标准交货期约为 15 周。有库存的数量由 Master Electronics 发货。
有存货: 708
可立即发货
库存数量的起订量: 64
缺货数量的起订量: 64
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 16
工厂交货期 15 周
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