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MCP6042-E/P

有存货: 840
起订量: 60

MCP6042-I/P by microchip technology

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Microchip Technology 授权经销商

MCP6042-I/P

Dual Op Amp - 14kHz GBP - 600nA - Rail to Rail I/O - 1.4 to 6.0 VDC - -40°C to 85°C - 8-lead PDIP ...

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符合 RoHS

TUBE 包装

描述

The MCP6042-I/P is a versatile dual operational amplifier designed for a wide range of applications. With a gain bandwidth product of 14kHz and ultra-low power consumption of only 600nA, this op amp is ideal for battery-powered devices and low power applications. It features rail-to-rail input and output operation, allowing for maximum dynamic range with a supply voltage range of 1.4 to 6.0 VDC. Operating in temperatures ranging from -40Â°C to 85Â°C, and housed in an 8-lead PDIP package, the MCP6042-I/P is a reliable and efficient choice for precision signal conditioning and filtering in various electronic designs.

产品亮点:

潜在应用:

搜索关键词: MCP6042IP

规格

产品属性

属性值

选择属性

找到的产品: 0

供应商:

Microchip Technology

部件编号:

MCP6042-I/P

计量单位:

每 Each

RoHS:

Yes

HTS:

8542330001

COO:

TH

ECCN:

EAR99

供应商标准包装:

此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。

60

封装类型:

TUBE

尺寸:

9.27 x 6.35 x 3.3 mm

常见问题

MCP6042-I/P 是否符合 RoHS 标准？

是的，MCP6042-I/P 符合 RoHS 标准。

MCP6042-I/P 的交货期是多少？

MCP6042-I/P 的标准交货期约为 5 周。有库存的数量由 Master Electronics 发货。

提供不同的包装选项。查看替代品

有存货: 540

可立即发货

BONDED 数量: 0

制造商库存: 0

仅库存批次:

最小订购数量: 60

缺货数量的起订量:

此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 60

工厂交货期 5 周

此产品已不再生产，但可能有替代品。我们可以帮助您, 连系我们.

价格 (USD)

数量

单价

60

$0.897

300

$0.837

540

$0.835

1,020

$0.829

2,520

$0.827

5,040

$0.825

7,500

$0.823

10,020 +

$0.821

供应商标准包装

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工具/3D模型

产品指南

产品更改

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.

PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 04-Mar-2013 - Microchip Has Released A New Devicedoc For The Mcp6041/2/3/4 Datasheet Of Devices In Order To Improv

PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

PCN - 28-Aug-2008 - Microchip is qualifying the G600C Mold Compound and 8361 J Die attach Epoxy for 8L, 14L, and 16L PDI

PCN - 24-Jun-2008 - Microchip is qualifying a new assembly site of 8L PDIP .300" package Linear Devices, Mixed Signal De

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP AT MMS ASSEMBLY

PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 11-Nov-2004 - Product Change Notice

PCN - 04-Mar-2013 - Data Sheet - Mcp6041/2/3/4 Datasheet Data Sheet Document Revision

PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 05-Nov-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 08-Mar-2007 - Product Change Notice

PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 20-May-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis

PCN - 06-Feb-2006 - Product Change Notice

PCN - 07-May-2008 - Microchip is qualifying the G600 mold compound for 8L PDIP package at UNIS in order to improve manuf

PCN - 17-Jun-2008 - Microchip is announcing the qualification of G600 mold compound for 8L PDIP package at units for the

PCN - 04-Apr-2008 - Microchip Is Cancelling The Ccb# 640 - Qualification Of 14L Pdip At New Assembly Site:Ac Due To The

PCN - 31-Mar-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS

PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 22-Jan-2004 - Product Change Notice

PCN - 22-Jan-2004 - QUALIFY UNISEM FOR ASSEMBLY OF 8L PDIP PACKAGES

PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP PACKAGE AT MMS

PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

PCN - 19-Sep-2008 - Microchip is qualifying E500 Mold Compound and 84-1LMISR4 Die Attach Epoxy for 8L PDIP Package at MM

PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

PCN - 30-Apr-2007 - Qualification Of 14L Pdip With Ge-800 ''Green'' Mold Compound At Vgt Assembly

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP

PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY AT ANAP ASSEMBLY

PCN - 19-May-2008 - ADDING NEW ASSEMBLY SITE

PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.

PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

PCN - 19-Apr-2010 - Microchip is announcing the qualification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for the

PCN - 15-Sep-2008 - Microchip is changing the bill of material by changing the mold compound to G600C and Die Attach Epo

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS

PCN - 19-Apr-2006 - Product Change Notice

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS

PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

PCN - 08-Oct-2010 - Microchip is announcing the quallification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for th