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24FC256T-I/MS

En stock: 2.500
pedido mínimo: 625

24FC256-I/MS by microchip technology

Imagen de referencia - consulte las especificaciones del fabricante

Microchip Technology Distribuidor Autorizado

24FC256-I/MS

EEPROM - Serial-I²C - 256Kb (32K x 8) - 1MHz - 1.8V/2.5V/3.3V/5V - 8-Pin MSOP - Tube

Ver hoja de datos

Preguntar a la hoja de datos

Cumple con RoHS

TUBE embalaje

DESCRIPCIÓN

EEPROM - Serial-I²C - 256Kb (32K x 8) - 1MHz - 1.8V/2.5V/3.3V/5V - 8-Pin MSOP - Tube

Características destacadas:

Aplicaciones potenciales:

Palabras clave de búsqueda: 24FC256IMS

ESPECIFICACIONES

Atributo del producto

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Productos Encontrados: 0

Proveedor:

Microchip Technology

Nº de pieza:

24FC256-I/MS

Unidad de medida:

Por Each

RoHS:

Yes

HTS:

8542320051

COO:

TH

ECCN:

EAR99

Empaque estándar del proveedor: Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.

Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.

100

Tipo de encapsulado:

TUBE

Retención de Datos:

200(Min) Year

PREGUNTAS FRECUENTES

¿Cumple 24FC256-I/MS con la normativa RoHS?

Sí, 24FC256-I/MS cumple con la normativa RoHS.

¿Cuál es el plazo de entrega de 24FC256-I/MS?

El plazo de entrega estándar de 24FC256-I/MS es de aproximadamente 5 semanas. Las cantidades disponibles se envían desde Master Electronics.

Diferentes opciones de embalaje disponibles. Ver Alternativas

EN STOCK: 600

Puede enviar inmediatamente

Cantidad BONDED: 0

Stock del fabricante: 1.700 puede enviar 10/12/26

Solo lote de stock:

Cantidad mínima de pedido: 100

MOQ para cantidad agotada:

Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.: 100

Plazo de entrega de fábrica 5 Semanas puede enviar 11/3/26

Este producto ya no se fabrica, pero puede haber alternativas. Podemos ayudarle, Contáctenos.

Precio (USD)

Cant.

Precio unitario

100

$0.746

300

$0.685

500

$0.683

1.000

$0.676

2.500

$0.633

5.000

$0.631

7.500

$0.617

10.000 +

$0.616

Embalaje estándar del proveedor

Inicie sesión para precios especiales

Herramientas/Modelos 3D

Guías de productos

Cambios del producto

PCN - 03-Apr-2013 - Microchip has released a new devicedoc for the 24AA256/24LC256/24FC256 data sheet of devices in orde

PCN - 26-Jan-2009 - CHANGE SHIPPING MATERIALS FROM MOISTURE BARRIER BAG TO STATIC SHIELDED BAG

PCN - 09-Jun-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY

PCN - 30-Jan-2006 -

PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 22-Jan-2004 - QUALIFY MTAI ASSEMBLY FOR LARGE PADDLES (82X94 MILS AND 84X105.6 MILS)

PCN - 06-Nov-2003 -

PCN - 04-Sep-2015 - QUALIFICATION OF 220K (0.18 MICRON) PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 26-Jun-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE

PCN - 13-Jul-2011 - Microchip has released a new devicedoc for the listed 24AA256/24LC256/24FC256 data sheet of devices

PCN - 17-Apr-2019 - RE-ISSUED FINAL NOTIFICATION - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE

PCN - 03-Apr-2013 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET DOCUMENT REVISION

PCN - 08-Jun-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K, 160K AND 250K WAFER TECHNOLOGIES

PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 02-Nov-2007 - CHANGE IN BOM

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 14-May-2010 - Microchip has released a new DeviceDoc for the 24AA256/24LC256/24FC256 Data Sheet of devices.

PCN - 08-Jun-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K, 160K AND 250K WAFER TECHNOLOGIES

PCN - 26-Nov-2013 - 24AA256/24LC256/24FC256 DATA SHEET DATA SHEET DOCUMENT REVISION

PCN - 03-Jun-2004 -

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com

PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 22-Dec-2017 - RE-ISSUED INITIAL NOTICE QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 08-Nov-2010 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 18-Jul-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

PCN - 26-May-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 150K AND 160K WAFER

PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to

PCN - 26-Nov-2013 - Microchip has released a new devicedoc for the listed 24AA256/24LC256/24FC256 data sheet of devices

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 25-Oct-2021 - DATA SHEET - 24AA256/24LC256/24FC256 256 KBIT I2C SERIAL EEPROM DATA SHEET DOCUMENT REVISION

PCN - 20-Aug-2018 - UPDATED FIRST LINE MARKING CODES TABLE

PCN - 23-May-2018 - ISSUED FINAL NOTIFICATION QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag

PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 04-Sep-2015 - QUALIFICATION OF 220K (0.18 MICRON) PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 10-Dec-2012 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET

PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 27-May-2010 - CONVERSION OF 24LC256, 24FC256 AND 24AA256 PRODUCT FAMILIES TO 160K TECHNOLOGY

PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 06-Mar-2006 -

PCN - 29-Jun-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 22-Jan-2004 -

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 150K AND 160K WAFER

PCN - 07-Aug-2019 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET CHANGE

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 08-Nov-2010 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 26-Feb-2009 - CHANGE SHIPPING MATERIALS FROM MOISTURE BARRIER BAG TO STATIC SHIELDED BAG

PCN - 27-May-2010 - 24LC256, 24FC256 and 24AA256 serial EEPROMs will be moved from their current 150K (0.5 micron) fabri

PCN - 23-Apr-2001 -

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 09-Jul-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 22-Dec-2017 - RE-ISSUED INITIAL NOTICE QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 05-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY

PCN - 10-Dec-2012 - 24AA256/24LC256/24FC256 DATA SHEET

PCN - 13-Jul-2011 - DATA SHEET-24AA256/24LC256/24FC256 DATA SHEET DATA SHEET DOCUMENT REVISION

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 22-Jan-2004 -

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 10-Dec-2012 - Microchip has released a new devicedoc for the 24AA256/24LC256/24FC256 data sheet of devices.

PCN - 11-Nov-2004 -

PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT