ATS-61270D-C1-R0
The ATS-61270D-C1-R0 is a high-performance fanSINK™ heat sink for BGA components featuring a maxiGRIP™ mechanical attachment system. ...
DESCRIPTION
The ATS-61270D-C1-R0 is a 27.00 x 27.00 x 9.50 mm high-performance fanSINK™ heat sink designed for cooling BGA components. It features X-Cut straightFIN fins that allow for omnidirectional air flow, ensuring optimum thermal performance regardless of the PCB layout. The unit utilizes the proven maxiGRIP™ attachment system, a high-reliability mechanical solution that includes a plastic frame clip and a stainless steel spring clip, avoiding the need for PCB through-holes. This attachment method meets Telecordia GR-63-Core, ETSI 300 019, and MIL-STD-810 shock and vibration standards. The heat sink is supplied with pre-assembled Chomerics T412 thermal interface material, making it a robust and convenient solution for demanding electronic applications.
Search Keywords: ATS61270DC1R0
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is ATS-61270D-C1-R0 RoHS compliant?
Yes, ATS-61270D-C1-R0 is RoHS compliant.
What is the lead time for ATS-61270D-C1-R0?
The standard lead time for ATS-61270D-C1-R0 is approximately 8 weeks. In-stock quantities ship from Master Electronics.
IN STOCK: 64
Can Ship immediately
Manufacturer Stock: 500 can ship 10/16/26
Minimum Order Quantity: 5
Factory Lead-Time 8 Weeks can ship 11/26/26
Price (USD)
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