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7173DG
Heat Sink Passive TO-220 Thru-Hole Copper 25.8°C/W Tin ...
描述
7173DG is a channel board level heat sink designed to cool TO-220 and TO-220-single gauge devices. Constructed from copper with a tin-plated finish, this heat sink features dimensions of 19.05 mm width, 9.52 mm length, and 19.05 mm height with vertical mounting orientation. The design includes a 3.81 mm through-hole and specific mounting dimensions with X dimension of 9.22 mm, Y dimension of 4.11 mm, and Z dimension of 2.54 mm. This RoHS compliant heat sink requires a mounting kit for device attachment and is ideal for board level thermal management applications where efficient heat dissipation from power semiconductors is required.
搜索关键词: 7173DG
规格
常见问题
7173DG 是否符合 RoHS 标准？
是的，7173DG 符合 RoHS 标准。
7173DG 的交货期是多少？
7173DG 的标准交货期约为 6 周。有库存的数量由 Master Electronics 发货。
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