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HTS654-U
TE Connectivity / Chip Coolers BrandHeat Sink Passive BGA Radial Aluminum Black Anodized ...
DESCRIPCIÓN
The HTS654-U is a heat sink assembly engineered for thermal management of BGA semiconductor packages. It features a 7-fin radial design constructed from aluminum with a black anodize finish, providing effective heat dissipation across a range of operating conditions. The assembly has a package size of 21 mm, a diameter of 34.92 mm, and a height of 22.70 mm, with a flammability rating of UL 94V-0. Thermal resistance varies from 10.56°C/W at 0 LFM to 2.06°C/W at 600 LFM depending on power dissipation levels (5W to 15W), making it suitable for applications requiring efficient passive cooling in compact form factors. The integrated two-leg mounting clip simplifies installation without increasing overall heat sink height, and the product is RoHS and ELV compliant.
Palabras clave de búsqueda: HTS654U
ESPECIFICACIÓN
EN STOCK: 130
Puede enviar inmediatamente
Cantidad mínima de pedido: 3
FICHA TÉCNICA