HTS191-P
TE Connectivity / Chip Coolers BrandHeat Sink Passive BGA Radial Clip Aluminum Black Anodized ...
DESCRIPCIÓN
HTS191-P is a heat sink assembly designed for thermal management of BGA semiconductor packages. This 25mm heat sink features a 2 fin radial design constructed from aluminum with a black anodize finish for enhanced heat dissipation. The product is EU RoHS/ELV compliant, ensuring environmental compliance for electronic applications. It is commonly used in applications requiring efficient cooling of BGA devices, providing reliable thermal performance in electronic systems.
Características destacadas del producto:
- Heat Sink
- BGA
- Package Size = 25 [.985] mm [in]
- For Use With BGA Semiconductor Packages
- Diameter = 25.00 mm
Palabras clave de búsqueda: HTS191P
ESPECIFICACIÓN
EN STOCK: 464
Puede enviar inmediatamente
Cantidad mínima de pedido: 6
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