HTS186-U
Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...
DESCRIPCIÓN
HTS186-U is a 21mm heat sink assembly designed for thermal management of BGA semiconductor packages. It features a radial fin style with 4 fins, constructed from aluminum with a black anodized plating for enhanced heat dissipation. The heat sink has a height of 13.97 mm, diameter of 25.4 mm, and supports power ratings of 5W, 10W, and 15W depending on airflow conditions. The assembly includes a two-leg mounting clip (Part Number 1542431-1) that does not increase overall heat sink height. This EU RoHS and ELV compliant component is ideal for cooling BGA devices in applications requiring efficient thermal solutions with UL 94V-0 flammability rating.
Palabras clave de búsqueda: HTS186U
ESPECIFICACIONES
FREQUENTLY ASKED QUESTIONS
Is HTS186-U discontinued?
Yes, HTS186-U from Te Connectivity / Chip Coolers Brand is discontinued. Master Electronics is an authorized distributor and may have remaining stock or a recommended replacement for it.
Is HTS186-U RoHS compliant?
Yes, HTS186-U is RoHS compliant.
What is the lead time for HTS186-U?
The standard lead time for HTS186-U is approximately 9 days. In-stock quantities ship from Master Electronics.
EN STOCK: 887
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Cantidad mínima de pedido: 10
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