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87456-1
06 MODIV HSG COMP DR .100CL ...
DESCRIPCIÓN
The 87456-1 is a single-row receptacle housing assembly from the AMPMODU Mod IV interconnection system designed for wire-to-board applications with 0.100 inch (2.54 mm) centerline spacing and end-to-end stackable configuration. The housing features a dual cantilever contact beam with built-in anti-overstress capability for reliable matings, accommodates 0.025 inch (0.64 mm) square or round post contacts, and is constructed from glass-filled thermoplastic material rated 94V-0. The receptacle assembly terminates 32-20 AWG (0.03-0.6 mm²) discrete wire with insulation support and offers a choice of three contact mating pressures with multiple gold and tin plating options. This product is ideal for applications requiring compact, stackable interconnections in electronic assemblies where reliable wire-to-board connections and space efficiency are critical.
Características destacadas:
- Receptacle Housing
- Wire Termination Type = Crimp
- Number of Positions = 6
- Housing Type = Receptacle
- Number of Rows = Dual
Palabras clave de búsqueda: 874561
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 87456-1 con la normativa RoHS?
Sí, 87456-1 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 87456-1?
El plazo de entrega estándar de 87456-1 es de aproximadamente 49 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 5.054
Puede enviar inmediatamente
Cantidad mínima de pedido: 25
Plazo de entrega de fábrica 49 Semanas
Precio (USD)
3D PDF
Hoja de datos
Product Specification - AMPMODU Mod 1/2 Wire to Board Standard Pressure Contact Interconnection System
