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58537-1
Crimping Die Tool Assembly ...
DESCRIPCIÓN
58537-1 is a crimping die assembly designed to crimp AMP 50-Ohm RF Series BNC dual-crimp connectors when used with the AMP PRO-CRIMPER II Frame Assembly 354940-1. The die assembly consists of an indenter die and an anvil die that form three crimping chambers: two larger chambers for crimping the ferrule onto the coaxial cable and one smaller chamber for crimping the center contact onto the center conductor. The die closure dimensions are specified as A: 1.27 ±0.05 mm [.050 ±.002 in.], B: 6.10 ±0.10 mm [.240 ±.004 in.], and C: 6.50 ±0.10 mm [.256 ±.004 in.], with a center contact crimping chamber designed to accommodate a copper bus bar of 1.57 mm ±0.05 mm [.062 in. ±.002 in.] diameter. This tool is designed primarily for field installation, repair, maintenance work, and prototyping in industrial, commercial, and institutional applications, offering reliable performance for occasional use and low-volume connector assembly operations.
Palabras clave de búsqueda: 585371
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 58537-1 con la normativa RoHS?
No, 58537-1 no cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 58537-1?
El plazo de entrega estándar de 58537-1 es de aproximadamente 10 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 0
MOQ para cantidad agotada: 3
Plazo de entrega de fábrica 10 Semanas
Hoja de datos