5-1437514-7
TE Connectivity / AMP BrandDiscrete Sockets ...
DESCRIPCIÓN
The 399-HT-114 is an AMP AUGAT HOLTITE solderless spring socket designed to form a zero-profile interconnect within a plated-through hole on a printed circuit board. Constructed from beryllium-copper with either gold or tin/lead plating, this socket is press-fit into the board, eliminating the need for soldering. The socket is designed for use in glass epoxy (FR-4, G-10) PC boards and is applied either manually or with automated machinery. This system creates a reliable, low-profile connection for a broad range of electronic parts and components. The solderless design provides a key advantage by allowing for easy component repair and replacement.
Características destacadas del producto:
- Hand Tool
- Production Application
Palabras clave de búsqueda: 514375147
ESPECIFICACIÓN
EN STOCK: 2
Puede enviar inmediatamente
Stock del fabricante: 32 puede enviar 6/1/26
Plazo de entrega de fábrica 12 Semanas puede enviar 8/10/26
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