5-103168-8
A 20-position, double-row, shrouded vertical header with straight posts on a .100 x .100 inch centerline for board-to-board connections. ...
DESCRIPCIÓN
The 5-103168-8 is a 20-position, double-row, shrouded vertical header from the AMPMODU Interconnection System. It features .025 inch square straight posts arranged in a .100 x .100 inch grid. The copper alloy contacts have duplex plating with .000030 inches of gold on the contact area and tin on the solder tails, all over a nickel underplate. Housed in a black, 94V-0 rated flame-retardant thermoplastic with detent windows, this header ensures secure and reliable mating. It is designed for board-to-board applications such as mother/daughter board connections and other subassembly interconnections.
Características destacadas:
- Header
- Header Type = Shrouded
- Number of Rows = Dual
- Number of Positions = 20
- Mating Post Length = 8.08 mm
Palabras clave de búsqueda: 51031688
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 5-103168-8 con la normativa RoHS?
Sí, 5-103168-8 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 5-103168-8?
El plazo de entrega estándar de 5-103168-8 es de aproximadamente 21 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 2.328
Puede enviar inmediatamente
Cantidad mínima de pedido: 10
Plazo de entrega de fábrica 21 Semanas
Precio (USD)
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