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1-87499-4
08 MODIV HSG COMP SR .100CL ...
DESCRIPCIÓN
The 1-87499-4 is a single-row receptacle housing assembly for the AMPMODU Mod IV interconnection system, featuring an outrigger design with end-to-end stackable capability. It is designed for dual-entry, low-profile applications with 0.100 inch [2.54 mm] by 0.100 inch [2.54 mm] centerline spacing and 0.200 inch [5.08 mm] tine spacing. The housing is constructed from glass-filled thermoplastic material rated 94V-0 and is available in both stamped and unstamped configurations with multiple position options ranging from 1 to 36 positions. Contact plating options include Plating A (duplex gold and matte tin), Plating B (duplex gold and matte tin), and Plating C (matte tin), all with nickel underplating. This housing is ideal for wire-to-board interconnection applications requiring reliable, stackable connections in compact form factors.
Características destacadas:
- Housing
- Not Preloaded
- Number of Positions = 8
- Housing Type = Receptacle
- Number of Rows = Single
Palabras clave de búsqueda: 1874994
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 1-87499-4 con la normativa RoHS?
Sí, 1-87499-4 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 1-87499-4?
El plazo de entrega estándar de 1-87499-4 es de aproximadamente 49 días. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 4.392
Puede enviar inmediatamente
MOQ para Cantidad en Stock: 25
MOQ para cantidad agotada: 1875
Plazo de entrega de fábrica 49 Semanas
Precio (USD)
3D PDF
Hoja de datos
Material Declaration - MD_1-87499-4_0617201177
