Iniciar sesión
ES
English
Chinese
Spanish
La imagen es representativa - ver especificaciones del fabricante
1-2823056-6
TE Connectivity / AMP BrandMICRO-MATCH VALUE LINE FEMALE-ON-BOARD TOP-ENTRY, SMD CONNECTOR WITH LATCHES
Cumple con RoHS
Terminado
DESCRIPCIÓN
MICRO-MATCH VALUE LINE FEMALE-ON-BOARD TOP-ENTRY, SMD CONNECTOR WITH LATCHES
Palabras clave de búsqueda: 128230566
ESPECIFICACIÓN
Atributo del producto
Valor de atributo
Seleccionar atributo
Productos Encontrados: 0
Proveedor:
TE Connectivity / AMP Brand
Nº de pieza:
1-2823056-6
Unidad de medida:
Por Each
RoHS:
Yes
HTS:
8536694040
ECCN:
EAR99
Paquete estándar del proveedor: 
1
Polarization:
With
Connector & Contact Terminates To:
Printed Circuit Board
Packaging Quantity:
900
Mating Entry Location:
Top
Connector System:
Board-to-Board
Contact Base Material:
Copper Alloy
Contact Underplating Material:
Nickel
PCB Mount Retention:
Without
Panel Mount Feature:
Without
Connector & Housing Type:
Receptacle
Termination Post & Tail Length:
.208 in, 5.3 mm
Mating Retention:
With
Connector Profile:
Standard
Row-to-Row Spacing:
1.5 mm
Contact Termination Area Plating Material:
Tin
PCB Mount Alignment:
Without
Daisy Chain:
Without
Connector Length:
.98 in, 24.9 mm
Header Type:
Shrouded
Operating Temperature Range:
-30 – 85 °C
Packaging Method:
Reel
Contact Retention Type within Housing:
Press-Fit
PCB Contact Termination Area Plating Material:
Tin
Connector Type:
Connector Assembly
UL Flammability Rating:
UL 94V-0
Connector Height:
.27 in, 6.9 mm
Contact Termination Area Plating Thickness:
118.11 – 196.85 µin, 3 – 5 µm
Mating Alignment Type:
Polarization
Centerline (Pitch):
.05 in, 1.27 mm
Contact Type:
Socket
Contact Design:
Dual Beam
PCB Thickness (Recommended):
.062 in, 1.6 mm
Housing Material:
PA 4.6
Housing Color:
Black
Type of Connector:
Female-on-Board
Contact Current Rating (Max):
1.3 A
Number of Positions:
16
PCB Mount Orientation:
Vertical
Product Type:
Connector Assembly
Operating Voltage:
100 VAC
Ejection Latches:
Without
Mating Retention Type:
Latch
Termination Method to Printed Circuit Board:
Surface Mount
Contact Mating Area Plating Material Thickness:
118.11 – 196.85 µin, 3 – 5 µm
Contact Mating Area Plating Material:
Tin
Circuit Application:
Signal
Insulation Resistance:
1000 MΩ
Solder Process Feature:
Board Standoff
Mating Alignment:
With
Ciclo vital:
Terminado
Este producto está descatalogado, pero aún en stock.
Posibles opciones de reemplazo disponibles. Ver Alternativas
EN STOCK: 3.600
Puede enviar inmediatamente
Cantidad mínima de pedido: 70
Qty
Precio por unidad
70
$0.92
400
$0.89
1.500
$0.85
4.000
$0.81
12.100
+
$0.78
FICHA TÉCNICA
