642-25AB
WakefieldHeat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized ...
DESCRIPCIÓN
The WAKEFIELD part 642-25AB is a high-quality heat sink designed for optimal cooling performance. With its passive BGA pin array design, it efficiently dissipates heat from electronic components, ensuring their longevity and reliability. The heat sink is made from adhesive aluminum with a sleek black anodized finish, providing excellent thermal conductivity and a visually appealing aesthetic. Ideal for a wide range of applications, this heat sink is a reliable choice for keeping your electronic systems running cool and efficient.
Palabras clave de búsqueda: 64225AB
ESPECIFICACIÓN
EN STOCK: 29
Puede enviar inmediatamente
Cantidad mínima de pedido: 10
Plazo de entrega de fábrica 16 Semanas
English
Chinese
Spanish
