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HTS285NF-D
TE Connectivity / Chip Coolers BrandHeat Sink Passive BGA Pin Array Cold-Forged Aluminum Black Anodized ...
DESCRIPCIÓN
HTS285NF-D is a BGA heat sink assembly designed for thermal management of BGA semiconductor packages. The unit features a cold-forged aluminum construction with a 50.80 mm diameter and 19.05 mm height, providing efficient heat dissipation in compact form factors. It includes a four-leg standard mounting clip (Part Number 1542026-1) that does not increase the overall heat sink height, enabling seamless integration into space-constrained applications. The assembly is RoHS and ELV compliant with a UL 94V-0 flammability rating, ensuring compliance with environmental and safety standards. This heat sink is ideal for high-performance computing, telecommunications, and industrial applications where reliable thermal management of BGA packages is critical.
Palabras clave de búsqueda: HTS285NFD
ESPECIFICACIÓN
EN STOCK: 80
Puede enviar inmediatamente
Cantidad mínima de pedido: 4
FICHA TÉCNICA