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87733-3
24 MODIV HSG W/STR RLF DR MRKD ...
DESCRIPCIÓN
The 87733-3 is a single-row receptacle assembly part of the AMPMODU Interconnection System Mod IV series, featuring an outrigger design with dual entry and low-profile construction. It is designed for 0.100 x 0.100 inch (2.54 x 2.54 mm) centerline spacing with 0.200 inch (5.08 mm) tine spacing and end-to-end stackable capability. The housing is constructed from glass-filled thermoplastic material rated 94V-0, with multiple contact plating options including duplex gold and matte tin finishes on nickel underplate. The receptacle assembly is available in various position configurations ranging from 3 to 40 positions, with options for tube or tape and reel packaging. This connector is ideal for applications requiring reliable board-to-board or wire-to-board interconnections in compact, stackable configurations.
Características destacadas:
- Housing
- Not Preloaded
- Number of Positions = 24
- Housing Type = Receptacle
- Number of Rows = Dual
Palabras clave de búsqueda: 877333
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Está descatalogado 87733-3?
Sí, 87733-3 de Te Connectivity / Amp Brand está descatalogado. Master Electronics es un distribuidor autorizado y es posible que aún tenga existencias o pueda ofrecer un reemplazo recomendado.
¿Cumple 87733-3 con la normativa RoHS?
Sí, 87733-3 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 87733-3?
El plazo de entrega estándar de 87733-3 es de aproximadamente 29 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 621
Puede enviar inmediatamente
Cantidad mínima de pedido: 25
3D PDF
Product Drawing - HOUSING ASSEMBLY, MOD IV, DBL ROW, 2.54[.100]
Hoja de datos
Product Specification - AMPMODU Mod 1/2 Wire to Board Standard Pressure Contact Interconnection System
Instruction Sheet - AMPMODU MOD IV RECEPTACLE CONNECTORS (WITH STRAIN RELIEF TABS)
