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DESCRIPCIÓN
583859-5 is a crimp snap twin leaf connector housing designed for high-density wire-to-board applications. This connector features 18 dual positions with a 0.156 inch (3.96 mm) centerline spacing and includes mounting ears for secure PCB attachment. Key dimensions include A: 2.972 inches (75.49 mm), B: 3.136 inches (79.55 mm), C: 2.848 inches (72.34 mm), D: 3.407 inches (86.54 mm), and E: 3.657 inches (92.89 mm). The housing is designed to accommodate PC boards with thickness of 0.055-0.070 inches (1.40-1.78 mm) and accepts snap-in contacts in various configurations including crimp, post, eyelet, and solder types. This versatile connector is suitable for wire-to-board and board-to-board interconnect applications requiring reliable, high-density connections.
Características destacadas:
- Housing
- 18 Dual Positions
- 3.96 mm Centerline
- With Mounting Ears
Palabras clave de búsqueda: 5838595
ESPECIFICACIONES
FREQUENTLY ASKED QUESTIONS
Is 583859-5 RoHS compliant?
Yes, 583859-5 is RoHS compliant.
What is the lead time for 583859-5?
The standard lead time for 583859-5 is approximately 9 days. In-stock quantities ship from Master Electronics.
EN STOCK: 1.825
Puede enviar inmediatamente
MOQ para Cantidad en Stock: 7
MOQ para cantidad agotada: 7
Plazo de entrega de fábrica 9 Semanas
Product Drawing - HOUSING, CRIMP SNAP TWIN LEAF, .156
Hoja de datos
Product Specification - Twin Leaf Crimp Snap Connector
Instruction Sheet - Twin Leaf Printed Circuit (PC) Board Edge Connectors
