DESCRIPCIÓN

2-557103-1 is a vertical board-to-board receptacle assembly connector from the CHAMP .050 Series I product line. This 80-position connector features a 1.27mm (0.050") contact pitch and is designed to accommodate mating printed circuit boards with a thickness of 1.6±0.07mm (0.063±0.003"). The housing is constructed from black PPA resin molding compound, while contacts are made of phosphor bronze with gold plating in the contact area and tin-lead plating on solder tines over nickel underplate. The connector is suitable for board-to-board interconnection applications requiring reliable high-density connections in electronic assemblies.