TSM-106-02-F-DH
The TSM-106-02-F-DH is a 12-position, double-row, horizontal surface-mount header with a 2.54 mm pitch for board-to-board connections. ...
DESCRIPCIÓN
The TSM-106-02-F-DH is a TSM series surface-mount header designed for board-to-board interconnects. It features a double-row, horizontal configuration with 6 pins per row for a total of 12 positions on a 2.54 mm pitch. The terminals are phosphor bronze with gold flash plating on the post and matte tin on the tail, housed in a black liquid crystal polymer insulator. This construction supports an operating temperature range from -55 °C to +125 °C. With a .320" post height, it is designed for mating with SSM-DH style connectors, making it suitable for various high-reliability applications.
Palabras clave de búsqueda: TSM10602FDH
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple TSM-106-02-F-DH con la normativa RoHS?
Sí, TSM-106-02-F-DH cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de TSM-106-02-F-DH?
El plazo de entrega estándar de TSM-106-02-F-DH es de aproximadamente 2 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 0
Cantidad mínima de pedido: 25
Plazo de entrega de fábrica 2 Semanas
Precio (USD)
Guías de productos
English
中文 / 汉语
Deutsch
Español
Nederlands
