PIC16C558-04/P by microchip technology

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PIC16C558-04/P

Microchip Technology

Microcontroller - PIC 16C - 8-Bit - 4MHz - 13 I/O - 3.5KB (2K x 14) OTP - 128 x 8 RAM - 3 to 5.5V - 18-PDIP. ...

Cumple con RoHS

TUBE embalaje

DESCRIPCIÓN

The PIC16C558-04/P from MICROCHIP TECH. is PIC 16C family 18-Pin PDIP EPROM-Based 8-Bit CMOS microcontroller. The PIC16C558-04/P microcontroller has 3.5KB (2K x 14) OTP program memory, 128 x 8 RAM size and 13 I/O general-purpose I/O pins. This microcontroller operates at a maximum frequency of 4MHz with wide operating voltage of 3 to 5.5V. Operating temperature range is from 0°C to 70°C.

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Aplicaciones potenciales:

Palabras clave de búsqueda: PIC16C55804P

ESPECIFICACIÓN

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Productos Encontrados: 0

Proveedor:

Microchip Technology

Nº de pieza:

PIC16C558-04/P

Unidad de medida:

Por Each

RoHS:

Yes

HTS:

8542310015

COO:

TH

ECCN:

EAR99

Paquete estándar del proveedor: Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d

Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d

25

Tipo de paquete:

TUBE

EN STOCK: 0

Cantidad BONDED: 0

Stock del fabricante: 12 puede enviar 5/29/26

A la orden: 350 puede enviar 8/10/26

Stock lot only:

MOQ para Cantidad en Stock: 5

MOQ para cantidad agotada: 38

Múltiple: 1

Plazo de entrega de fábrica 33 Semanas puede enviar 1/4/27

Este producto ya no se fabrica, pero puede haber alternativas. Te podemos ayudar, Contacta con nosotras.

Precio (USD)

Qty

Precio por unidad

5

$7.28

10

$7.26

25

$7.24

38

$7.22

75

$5.49

113

$5.10

150 +

$5.00

Suppliers Standard Package

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Tools/3D Models

Guías de productos

Product Changes

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 23-Dec-2011 - Qualification Of 18L Pdip At Alph (Mmt) Assembly Site

PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 08-Mar-2007 - Product Change Notice

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 31-May-2007 - QUALIFICATION OF SAC305 ALLOY SOLDER DIPPING FOR CERDIPS AT MMT

PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 05-Sep-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY FOR 18L AND 20L PDIP PACKAGES

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 06-Mar-2006 - Product Change Notice

PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 15-Mar-2001 - Mtai Change; 18-Lead Pdip (/P) Package Paddle Size From 140X160 Mil To 160X250 For The Picmicro/Sdp

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 27-Jan-2012 - Ccb 1090 Final Notification: Qualification Of 18L Pdip At Alph (Mmt)

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 11-Nov-2004 - Product Change Notice

PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 05-Aug-2008 - Microchip is changing the bill of material i.e mold Compound and Die attach epoxy in order to improv

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ