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MCP6022T-I/SN

Microchip Technology

Rail-to-Rail - Input/Output - 10 MHz - Dual Op Amp - Industrial Temperature - 8LD SOIC Package

FICHA TÉCNICA

Cumple con RoHS

REEL embalaje

DESCRIPCIÓN

The MCP6022T-I/SN is a rail-to rail input and output operational amplifier with high performance, and wide band width 10MHz. It works in industrial temp. range -40°C-85°C. Package type is a Plastic SOIC (150 mil Body), 8-Lead.

Características destacadas del producto:

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Palabras clave de búsqueda: MCP6022TISN

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EN STOCK: 1.800

Puede enviar inmediatamente

Cantidad BONDED: 0

Stock del fabricante: 14 puede enviar 5/18/26

Stock lot only:

Cantidad mínima de pedido: 250

MOQ para cantidad agotada:

Múltiple: 1

Plazo de entrega de fábrica 5 Semanas puede enviar 6/8/26

Este producto ya no se fabrica, pero puede haber alternativas. Te podemos ayudar, Contacta con nosotras.

Qty

Precio por unidad

250

$1.33

500

$1.32

1.000

$1.31

3.300 +

$1.30

Reel Package

Tools/3D Models

Guías de productos

FICHA TÉCNICA

Product Changes

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 22-Jan-2004 - Product Change Notice

PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 26-May-2005 - Product Change Notice

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 28-Jun-2005 - Product Change Notice

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 11-Nov-2004 - Product Change Notice

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 30-Jan-2006 - Product Change Notice

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 08-Mar-2007 - Product Change Notice

PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

Master Electronics - Distribuidor Autorizado de Componentes Electrónicos

Master Electronics - Distribuidor Autorizado de Componentes Electrónicos

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MCP6022T-I/SN

DESCRIPCIÓN

ESPECIFICACIÓN

Standard Packaging

Reel Packaging

Tools/3D Models

Guías de productos

Product Changes