4865-454G
* Meets J-STD-004 and QQ-S-571 * No Clean * Standard Flux Core percentage at 2.2% * Melting Point: 183 ° C / 361 ° F ...
DESCRIPCIÓN
4865 Sn63/Pb37 No-Clean Solder Wires is electronics grade solder wire. This no-clean solder wire uses the standard eutectic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, splatter-proof, resin flux core. It meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 63/37 solder wire is one of the easiest solders to work with because it combines a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.This leaded solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, resulting in a top-grade solder wire.For Sn63/Pb37 RA solder wire try 4880-4888. We also offer Sn60/Pb40 No-Clean Solder Wire and Sn60/Pb40 RA Solder Wire.For a lead-free solder wire try 4900-4917, 4901, or 49500WS.
Palabras clave de búsqueda: 4865454G
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 4865-454G con la normativa RoHS?
No, 4865-454G no cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 4865-454G?
El plazo de entrega estándar de 4865-454G es de aproximadamente 2 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 9
Puede enviar inmediatamente
Compre todos los 9 en stock o la cantidad mínima regular de pedido de 10
Solo lote de stock: 9
Cantidad mínima de pedido: 10
Plazo de entrega de fábrica 2 Semanas
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