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EXP-355
Solderless Breadboard, 588 Tie-points | Global Specialties EXP-355 ...
DESCRIPCIÓN
The EXP-355 is a solderless breadboard featuring 470 tie-points and 94 terminal clips designed for rapid circuit prototyping and design expansion. It incorporates molded-in interlocking edge rails on all four sides that permit parallel or perpendicular socket arrays, allowing multiple boards to be connected for maximum circuit design flexibility. The breadboard is constructed from high-impact ABS plastic with nickel-plated phosphor bronze spring clips and includes a heavy-duty Mylar backing to prevent short circuits. With 0.3" DIP spacing, integrated bus strips for power and signal connections, and the ability to accommodate up to 5 16-pin ICs, the EXP-355 supports a current capacity of 1.5 A at 36 V. Its molded-in mounting holes enable both front and rear mounting configurations, making it ideal for educational, hobbyist, and professional prototyping applications where circuit flexibility and reliability are essential.
Palabras clave de búsqueda: EXP355
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple EXP-355 con la normativa RoHS?
Sí, EXP-355 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de EXP-355?
El plazo de entrega estándar de EXP-355 es de aproximadamente 14 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 0
Plazo de entrega de fábrica 14 Semanas
Hoja de datos