10-8108
The 10-8108 is a silicone-based heat sink compound designed for thermal management in electronic applications. ...
DESCRIPCIÓN
The 10-8108 is a non-hazardous, silicone-based heat sink compound formulated to improve thermal conductivity between components. This off-white, odorless paste features a high specific gravity of 2.4 and remains stable across a wide temperature range, with a freezing point of -40°C and a decomposition temperature of 260°C. Composed primarily of zinc oxide, it is insoluble in water and has a high flash point of 204°C. It is ideal for applications requiring efficient and reliable heat transfer from electronic components to heat sinks or chassis.
Palabras clave de búsqueda: 108108
ESPECIFICACIONES
FREQUENTLY ASKED QUESTIONS
Is 10-8108 RoHS compliant?
Yes, 10-8108 is RoHS compliant.
What is the lead time for 10-8108?
The standard lead time for 10-8108 is approximately 1 days. In-stock quantities ship from Master Electronics.
EN STOCK: 370
Puede enviar inmediatamente
Stock del fabricante: 1.113 puede enviar 8/20/26
Cantidad mínima de pedido: 2
Plazo de entrega de fábrica 1 Semana puede enviar 8/21/26
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