10-8108
GC ElectronicsThe 10-8108 is a silicone-based heat sink compound designed for thermal management in electronic applications. ...
DESCRIPCIÓN
The 10-8108 is a non-hazardous, silicone-based heat sink compound formulated to improve thermal conductivity between components. This off-white, odorless paste features a high specific gravity of 2.4 and remains stable across a wide temperature range, with a freezing point of -40°C and a decomposition temperature of 260°C. Composed primarily of zinc oxide, it is insoluble in water and has a high flash point of 204°C. It is ideal for applications requiring efficient and reliable heat transfer from electronic components to heat sinks or chassis.
Palabras clave de búsqueda: 108108
ESPECIFICACIÓN
EN STOCK: 482
Puede enviar inmediatamente
Stock del fabricante: 291 puede enviar 5/11/26
Cantidad mínima de pedido: 5
Plazo de entrega de fábrica 3 Semanas puede enviar 5/25/26
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