BDN10-3CB/A01
Heat Sink Passive Pin Array Adhesive 26.4°C/W Black Anodized ...
DESCRIPCIÓN
CTS CORP BDN10-3CB/A01 is a reliable and high-performance heat sink designed with a passive pin array. This heat sink is specially engineered to efficiently dissipate heat from electronic components, ensuring their optimal operating temperatures. With an admirable thermal resistance of 26.4°C/W, this heat sink effectively prevents overheating and enhances the overall longevity and performance of the system.The sleek and durable black anodized finish not only adds a touch of elegance to the heat sink but also provides excellent corrosion resistance, thereby prolonging its lifespan. Furthermore, the adhesive feature of this heat sink facilitates a hassle-free installation process, saving valuable time and effort.CTS CORP BDN10-3CB/A01 is the ideal solution for various electronic applications, including computers, telecommunications equipment, power supplies, and LED lighting systems, where efficient heat dissipation is essential. Its robust design and exceptional thermal performance make it a dependable choice for industrial and commercial environments.Engineered with precision and built to last, CTS CORP BDN10-3CB/A01 ensures optimal thermal management, reliability, and superior performance, making it a preferred choice for engineers and professionals alike.
Palabras clave de búsqueda: BDN103CBA01
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple BDN10-3CB/A01 con la normativa RoHS?
Sí, BDN10-3CB/A01 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de BDN10-3CB/A01?
El plazo de entrega estándar de BDN10-3CB/A01 es de aproximadamente 11 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 864
Puede enviar inmediatamente
Cantidad mínima de pedido: 10
Plazo de entrega de fábrica 11 Semanas
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