7141DG
Heat Sink Passive TO-220 Vertical Thru-Hole Copper 20.3A°C/W Matte Tin ...
DESCRIPCIÓN
The 7141DG is a narrow channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from copper with a tin-plated finish, it features an integrated mounting clip for secure device attachment and is mounted vertically on the board. The heat sink measures 13.21 mm in width, 13.08 mm in length, and 19.81 mm in height, with dimensional specifications including a "y" dimension of 0.33 mm and a "z" dimension of 2.77 mm. This compact design provides effective thermal management for power devices, with thermal performance varying based on air velocity, making it suitable for applications requiring efficient heat dissipation in space-constrained environments. The product is RoHS compliant, ensuring environmental and regulatory compliance.
Palabras clave de búsqueda: 7141DG
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 7141DG con la normativa RoHS?
Sí, 7141DG cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 7141DG?
El plazo de entrega estándar de 7141DG es de aproximadamente 6 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 3.188
Puede enviar inmediatamente
MOQ para Cantidad en Stock: 10
MOQ para cantidad agotada: 875
Plazo de entrega de fábrica 6 Semanas
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