593202B03500G
Boyd Laconia LLCThe 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...
DESCRIPCIÓN
The 593202B03500G is a board-level heat sink from the Space Saving 5932 series, engineered for thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish for durability and performance, it measures 35.05 mm in width, 12.20 mm in length, and 50.80 mm in height. This component features a staggered fin design for efficient heat dissipation and is intended for vertical mounting. It is ideal for applications requiring effective cooling of power components in space-constrained board-level environments and requires a separate mounting kit for device attachment.
Palabras clave de búsqueda: 593202B03500G
ESPECIFICACIÓN
EN STOCK: 835
Puede enviar inmediatamente
A la orden:
8.000
puede enviar 5/28/26
MOQ para Cantidad en Stock: 5
MOQ para cantidad agotada: 400
Plazo de entrega de fábrica 13 Semanas
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