513202B02500G
The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices. ...
DESCRIPCIÓN
The 513202B02500G is a dual radial, board-level heat sink from the Extruded 5000 series, specifically designed for the thermal management of TO-220 packaged devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 50.80 mm in height and 34.92 mm in width. It features solderable pins for secure board attachment and can be mounted in either a horizontal or vertical orientation. This component is ideal for applications requiring efficient heat dissipation from power components on a printed circuit board, ensuring device reliability and performance.
Palabras clave de búsqueda: 513202B02500G
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 513202B02500G con la normativa RoHS?
Sí, 513202B02500G cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 513202B02500G?
El plazo de entrega estándar de 513202B02500G es de aproximadamente 8 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 0
Cantidad mínima de pedido: 5
Plazo de entrega de fábrica 8 Semanas
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