SF-1206S250-2
BournsFuse Chip Slow Blow Acting 2.5A 32V SMD Solder Pad 1206 T/R UL ...
DESCRIPCIÓN
SF-1206S250-2 is a slow blow thin film chip fuse designed for overcurrent protection in compact surface mount applications. It features a rated current of 2.5 A with a typical resistance of 33 mO and an I²t value of 0.605 A²s, providing reliable protection with a fusing time within 5 seconds at 250% of rated current. The fuse is housed in a miniature 3216 (EIA 1206) footprint with ceramic substrate construction and Sn plating, suitable for automated assembly and reflow soldering at peak temperatures of 250°C. Operating over a temperature range of -20°C to +105°C, this UL-listed (UL 248-14), RoHS-compliant, and halogen-free fuse is ideal for portable electronics, battery chargers, LCD monitors, and industrial controllers where space constraints and reliable overcurrent protection are essential.
Palabras clave de búsqueda: SF1206S2502
ESPECIFICACIÓN
EN STOCK: 15.000
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MOQ para Cantidad en Stock: 50
MOQ para cantidad agotada: 1250
Plazo de entrega de fábrica 12 Semanas
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