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MDM-37SL1B
The MDM-37SL1B is a 37-position Micro-D metal shell socket connector with 1/2-inch uninsulated solid #25 AWG wire terminations. ...
DESCRIPCIÓN
The MDM-37SL1B is a high-reliability, microminiature D-sub connector designed for applications requiring a rugged, lightweight, and high-density interconnect solution. This connector features an aluminum shell for strength and EMI/RFI shielding, and a Liquid Crystal Polymer (LCP) insulator housing 37 gold-plated copper alloy socket contacts on .050-inch centers. It is configured with 1/2-inch long, uninsulated solid #25 AWG gold-plated copper wire terminations and standard mounting holes with a .091-inch diameter and no pre-installed hardware. Engineered for high-performance, moisture-sealed applications, it is suitable for use in demanding environments such as aerospace, defense electronics, and industrial automation.
Palabras clave de búsqueda: MDM37SL1B
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple MDM-37SL1B con la normativa RoHS?
No, MDM-37SL1B no cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de MDM-37SL1B?
El plazo de entrega estándar de MDM-37SL1B es de aproximadamente 18 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 19
Puede enviar inmediatamente
Plazo de entrega de fábrica 18 Semanas
Hoja de datos
Learn more about ITT Cannon Micro-D / MDM Series