7023B-MTG
Heat Sink Passive TO-220 Folded Back Thru-Hole Aluminum 4.4A°C/W Black Anodized ...
DESCRIPCIÓN
The 7023B-MTG is a channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish, this heat sink features a vertical mounting orientation and requires a mounting kit for device attachment. The heat sink dimensions are 48.26 mm width, 24.13 mm length, and 49.53 mm height, with mounting hole specifications of X: 13.97 mm (0.550 in), Y: 3.18 mm (0.125 in), and Z: 3.10 mm (0.122 in). The device is RoHS compliant and provides thermal management through natural or forced air convection, with thermal performance varying based on air velocity. This heat sink is ideal for applications requiring compact board-level thermal solutions for power semiconductor packages in industrial, automotive, and consumer electronics.
Palabras clave de búsqueda: 7023BMTG
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 7023B-MTG con la normativa RoHS?
Sí, 7023B-MTG cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 7023B-MTG?
El plazo de entrega estándar de 7023B-MTG es de aproximadamente 6 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 5.554
Puede enviar inmediatamente
Cantidad mínima de pedido: 5
Plazo de entrega de fábrica 6 Semanas
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